Incheon, South Korea

Hyun-Seop Shim

This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignees: Samsung Electronics Co., Ltd., Isc Technology Co., Ltd.. Active years: 2005-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyun-Seop Shim. Retrieved from https://idiyas.com/inventor/hyun-seop-shim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 40.0

Average Co-Inventor Count = 6.6

ph-index = 3

Forward Citations = 24(Granted Patents)


Location History:

  • Incheon-si, KR (2006 - 2007)
  • ChoongChungNam-do, KR (2005 - 2008)
  • Incheon Metropolitan, KR (2008)

Company Filing History:


Years Active: 2005-2008

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5 patents (USPTO):Explore Patents

Title: Hyun-Seop Shim: Innovator in Semiconductor Testing Technology

Introduction

Hyun-Seop Shim is a notable inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His innovative work focuses on improving testing methods for semiconductor packages, which is crucial for the advancement of electronic devices.

Latest Patents

One of Hyun-Seop Shim's latest patents is a connector for testing a semiconductor package. In this invention, a connector is created using a mixture of insulating silicone powder and conductive powder. The connector features a body formed from the insulating silicone powder, along with regularly arrayed conductive silicone members that migrate to a site corresponding to a solder ball of the semiconductor package. This design includes a high-density conductive silicone part that protrudes from the upper surface of the connector body and a low-density conductive silicone part aligned beneath it, enhancing the connector's functionality.

Another significant patent is related to a multichip package test apparatus. This apparatus is designed for testing a multi-chip package that comprises multiple semiconductor chips. It includes a test driver with one drive channel and at least one input/output channel. The test board is mounted with the multi-chip package, allowing for efficient testing of the semiconductor chips.

Career Highlights

Hyun-Seop Shim has worked with prominent companies in the technology sector, including Samsung Electronics Co., Ltd. and Isc Technology Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Throughout his career, Hyun-Seop Shim has collaborated with talented individuals such as Jeong-Ho Bang and Ki-Bong Ju. These collaborations have likely fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Hyun-Seop Shim is a distinguished inventor whose work in semiconductor testing technology has made a significant impact on the industry. His innovative patents and collaborations highlight his commitment to advancing technology in this critical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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