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For the Inventor, By the Inventor

Incheon-si, South Korea

Hyun-Seop Shim

USPTO Granted Patents = 5 

Average Co-Inventor Count = 6.6

ph-index = 3

Forward Citations = 24(Granted Patents)


Location History:

  • Incheon-si, KR (2006 - 2007)
  • ChoongChungNam-do, KR (2005 - 2008)
  • Incheon Metropolitan, KR (2008)

Company Filing History:

goldMedal5 out of 131,744 
 
Samsung Electronics Co., Ltd.
 patents
silverMedal1 out of 2 
 
Isc Technology Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2005-2008

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5 patents (USPTO):Explore Patents
1. 7438563 - Connector for testing a semiconductor package (2008-10-21),
2. 7327154 - Multichip package test (2008-02-05),
3. 7227351 - Apparatus and method for performing parallel test on integrated circuit devices (2007-06-05),
4. 7084655 - Burn-in test apparatus for BGA packages using forced heat exhaust (2006-08-01),
5. 6943577 - Multichip package test (2005-09-13),
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