The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2008
Filed:
Jul. 27, 2005
Young-gu Shin, ChoongChungNam-do, KR;
Kyoung-il Heo, ChoongChungNam-do, KR;
Hyoung-young Lee, Kyunggi-do, KR;
Hyuk Kwon, ChoongChungNam-do, KR;
Ki-bong Ju, ChoongChungNam-do, KR;
Jeong-ho Bang, Kyunggi-do, KR;
Hyun-seop Shim, ChoongChungNam-do, KR;
Young-Gu Shin, ChoongChungNam-do, KR;
Kyoung-Il Heo, ChoongChungNam-do, KR;
Hyoung-Young Lee, Kyunggi-do, KR;
Hyuk Kwon, ChoongChungNam-do, KR;
Ki-Bong Ju, ChoongChungNam-do, KR;
Jeong-Ho Bang, Kyunggi-do, KR;
Hyun-Seop Shim, ChoongChungNam-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.