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For the Inventor, By the Inventor

Asan, South Korea

Hyun-Ik Hwang

This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2007-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyun-Ik Hwang. Retrieved from https://idiyas.com/inventor/hyun-ik-hwang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 50.0

Average Co-Inventor Count = 4.3

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:

goldMedal4 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2007-2011

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4 patents (USPTO):Explore Patents
1. 7989939 - Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire (2011-08-02),
2. 7405105 - Stack package using anisotropic conductive film (ACF) and method of making same (2008-07-29),
3. 7291925 - Stack package using anisotropic conductive film (ACF) and method of making same (2007-11-06),
4. 7288436 - Semiconductor chip package manufacturing method including screen printing process (2007-10-30),

Title: The Innovations of Hyun-Ik Hwang

Introduction

Hyun-Ik Hwang is a prominent inventor based in Asan, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving semiconductor packaging, which is crucial for the performance and reliability of electronic devices.

Latest Patents

One of Hyun-Ik Hwang's latest patents is a semiconductor package that includes an insulating layer located between package substrates. This innovation may prevent electrical shorts caused by bonding wires. The semiconductor package features a bonding wire that electrically connects a first package substrate and a second package substrate, with an insulating layer adhering the two substrates and covering a portion of the bonding wire.

Another notable patent is for a stack package using anisotropic conductive film (ACF). This invention aims to reduce thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages. It also facilitates the repair and rework of stack packages incorporating CSPs while minimizing the risk of damage to the CSPs. The stack package typically includes a circuit board, a semiconductor chip mounted on it, and solder balls or other conductive structures arranged around the semiconductor chip on the peripheral regions of the circuit board.

Career Highlights

Hyun-Ik Hwang is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to contribute to cutting-edge technologies in semiconductor packaging.

Collaborations

He has collaborated with notable coworkers such as Jun-Soo Han and Gil-Beag Kim, further enhancing the innovative environment at Samsung Electronics.

Conclusion

Hyun-Ik Hwang's contributions to semiconductor technology through his patents demonstrate his commitment to innovation in the electronics field. His work continues to influence the development of reliable and efficient electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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