The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2007
Filed:
Dec. 06, 2004
Sang-young Kim, Cheonan-si, KR;
Gil-beag Kim, Asan-si, KR;
Yong-jin Jung, Cheonan-si, KR;
Jun-soo Han, Cheonan-si, KR;
Hyun-ik Hwang, Asan-si, KR;
Sang-Young Kim, Cheonan-si, KR;
Gil-Beag Kim, Asan-si, KR;
Yong-Jin Jung, Cheonan-si, KR;
Jun-Soo Han, Cheonan-si, KR;
Hyun-Ik Hwang, Asan-si, KR;
Samsung Electronics, Co., Ltd., Gyeonggi-Do, KR;
Abstract
A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.