Jun-Soo Han

Title: Innovations by Jun-Soo Han

Introduction

Jun-Soo Han is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patents. With a total of 3 patents, Han's work focuses on enhancing the reliability and efficiency of chip scale packages.

Latest Patents

One of his latest patents is titled "Stack package using anisotropic conductive film (ACF) and method of making same." This invention addresses the challenges of thermal stresses that chip scale packages (CSPs) face during their initial manufacturing. The stack package utilizes an anisotropic conductive film to facilitate the repair and rework of CSPs while minimizing the risk of damage. Each CSP in the stack typically consists of a circuit board, a semiconductor chip, and conductive structures such as solder balls. Han's methods not only improve the production of these stack packages but also provide supplemental techniques for their maintenance.

Career Highlights

Jun-Soo Han is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in electronic devices.

Collaborations

Han has collaborated with notable colleagues, including Gil-Beag Kim and Sang-Young Kim. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Jun-Soo Han's contributions to semiconductor packaging through his patents demonstrate his commitment to innovation in the field. His work not only enhances the manufacturing process but also ensures the longevity and reliability of electronic components.