Company Filing History:
Years Active: 2012-2020
Title: Hyo-Bin Park: Innovator in Printed Circuit Board Technology
Introduction
Hyo-Bin Park is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of printed circuit board technology, holding a total of 2 patents. His work focuses on innovative methods and designs that enhance the functionality and efficiency of electronic components.
Latest Patents
Hyo-Bin Park's latest patents include advancements in printed circuit boards and semiconductor packages. The first patent describes a printed circuit board that features first and second insulating layers forming a cavity. This design includes a first heat releasing layer on the exterior surface of the cavity, along with a circuit layer positioned above or below the first insulating layer. Notably, the heat releasing layer is electrically connected to a portion of the circuit layer, improving thermal management in electronic devices.
The second patent outlines a manufacturing method for a printed circuit board that incorporates an electro component. This method involves several steps, including seating an electro component with an electrode on a bonding sheet, placing an insulator with a corresponding cavity on top, and laminating a first insulating resin to cover the electro component. The process concludes with polishing the resin to expose the electrode and forming a circuit pattern that connects electrically to the exposed electrode.
Career Highlights
Hyo-Bin Park is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in the field of electronics. His work has been instrumental in developing technologies that are essential for modern electronic devices.
Collaborations
Throughout his career, Hyo-Bin Park has collaborated with notable colleagues, including Suk-Chang Hong and Dong-Kwang Shin. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Hyo-Bin Park is a key figure in the advancement of printed circuit board technology, with a focus on innovative designs and manufacturing methods. His contributions are shaping the future of electronics and enhancing the performance of various devices.