The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
Jan. 09, 2009
Doo-hwan Lee, Cheongju-si, KR;
Kyung-min Lee, Daejeon, KR;
Hyo-bin Park, Daejeon, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Abstract
A manufacturing method of a printed circuit board having an electro component is disclosed. The method in accordance with an embodiment of the present invention includes: seating an electro component, in which an electrode is formed on an upper side, on an upper side of a bonding sheet; seating an insulator, in which a cavity corresponding to the electro component has been formed, on the upper side of the bonding sheet; laminating a first insulating resin on an upper side of the insulator such that an upper side of the electro component is covered; polishing the first insulating resin such that the electrode is exposed; and forming a first circuit pattern, which is electrically connected to the exposed electrode, on the polished first insulating resin.