Yongin, South Korea

Doo-Hwan Lee

This inventor holds 17 USPTO granted patents and 7 published patent applications and 2 EPO patents, primarily in Printed Circuit Boards. Top assignees: Samsung Electro-Mechanics Co., Ltd., Samsung Sdi Co., Inc., Samsung Electronics Co., Ltd.. Active years: 2008-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Doo-Hwan Lee. Retrieved from https://idiyas.com/inventor/doo-hwan-lee-zjg3hsfb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 17 

% Patents Active = 35.3

 

Average Co-Inventor Count = 4.1

ph-index = 4

Forward Citations = 58(Granted Patents)


Location History:

  • Incheon, KR (2008)
  • Chungcheongbuk-do, KR (2008)
  • Cheongju-si, KR (2012)
  • Yongin-si, KR (2010 - 2015)
  • Uijeongbu-si, KR (2017)
  • Gyeonggi-do, KR (2016 - 2018)

Company Filing History:


Years Active: 2008-2018

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Areas of Expertise:
Network Searching
Communication Methods
Electronic Component Package
Printed Circuit Board
Porous Oxide Catalyst
Fuel Processor
Temperature Control
Desulfurizer
Fuel Cell System
Embedded Components
Weak Magnetic Field Sensor
Manufacturing Method
17 patents (USPTO):Explore Patents

Title: Doo-Hwan Lee: A Vanguard of Innovation in Wireless Communication

Introduction

Doo-Hwan Lee, an accomplished inventor based in Yongin-si, South Korea, has made significant contributions to the field of communications technology. With a remarkable portfolio of 17 patents, his work has revolutionized methods for improving wireless communication processes.

Latest Patents

Doo-Hwan Lee's latest patents showcase his innovative prowess. One notable patent is for a method and device that facilitates network searching by devices supporting multiple communication methods. This technology addresses the complexities of modern wireless communication environments that utilize various communication methods. The method allows devices to determine an effective communication mode during booting or rebooting events, ultimately reducing the signal scanning time required for network access.

Another prominent patent is the design of an electronic component package. This package consists of a core that features a cavity, a first resin layer, a second resin layer, and a reinforcing layer located between the first and second resin layers. An electronic component is strategically placed within the cavity, with specified thickness variations between the resin layers, enhancing the durability and functionality of electronic devices.

Career Highlights

Doo-Hwan Lee has built a noteworthy career through his work with prestigious companies, including Samsung Electro-Mechanics Co., Ltd. and Samsung SDI Co., Inc. His roles within these organizations have allowed him to hone his skills and contribute significantly to advancements in electronic and communication technologies.

Collaborations

Throughout his career, Lee has collaborated with various talented individuals, including colleagues Hyun-chul Lee and Soon-ho Kim. These partnerships have fostered a collaborative environment that encourages innovation and the development of groundbreaking solutions in their fields.

Conclusion

Doo-Hwan Lee stands out as a prominent figure in the innovation landscape of communications technology. With his extensive patent portfolio and collaborative spirit, he continues to influence and shape the future of wireless communication, paving the way for further advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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