Samsung Electro-mechanics Co., Ltd.

Samsung Sdi Co., Inc.

Samsung Electronics Co., Ltd.

Doo-Hwan Lee

Hyun-chul Lee

Soon-ho Kim

Kang-hee Lee

Jae-Kul Lee

Moon-Il Kim

Hyung-Tae Kim

Myung-Sam Kang

Chang-Sup Ryu

Won-Cheol Bae

Kyung-Jin Han

Tae-Young Oh

Je-Gwang Yoo

Hyun-Chul Lee

Seon-ah Jin

Kyung-Min Lee

Ki-Won Lee

Do-young Seung

Byoung-Youl Min

Seong-Won Son

Jong-Myeon Lee

Sang-Duck Kim

Il-Pyo Hong

Seung-Gu Kim

Sang-min Ji

Hyo-Bin Park

Jun-Ki Seo

Young-Ho Yoon

Jong-Rip Kim

Kang-hao Lee

Tae-Sin Song

Sung-Hyun Ryu

Sang-Min Ji

Seon-Ah Jin

A method and device for searching for a network in a wireless communication environment supporting a plurality of communication methods are provided. An example method to support Simultaneous Voice and LTE (SVLTE) and Circuit Switch-FallBack (CSFB) involves determining a communication mode when a booting or rebooting event or no-data service event occurs, and only searching for a signal related to a selected one of the communication modes, thereby reducing total scan time needed to access a network.

Network searching by device supporting multiple communication methods

An electronic component package includes: a core including a cavity, a first resin layer, a second resin layer and a reinforcing layer disposed between the first resin layer and the second resin layer; and an electronic component disposed in the cavity, wherein a thickness of the first resin layer is different from a thickness of the second resin layer.

Electronic component package

An apparatus and method for providing an LTE service in an electronic device. The method includes: transmitting or receiving a voice signal through a first antenna and a data signal through a second antenna when the electronic device provides a multi-communication service. At least one switch connects at least one antenna and at least one communication interface with each other. When the electronic device provides a single communication service, transmitting or receiving a data signal or a voice signal through the first antenna, using the at least one switch.

Method for providing communication service and electronic device thereof

A method of manufacturing a printed circuit board (PCB) having an embedded bare chip includes attaching a tape to one side of an insulated substrate having a penetration hole formed therein, and attaching the bare chip onto the tape inside the penetration hole such that electrode pads of the bare chip face the tape; filling up the penetration hole with a filler, and removing the tape; laminating a metal layer onto a surface of the filler and the insulated substrate from which the tape is removed; and forming electrode bumps by removing portions of the metal layer. The forming of electrode bumps further includes simultaneously removing portions of the metal layer and forming an circuit pattern on one side of the insulated substrate. The circuit pattern is formed directly on the upper side of the insulated substrate and the electrode bumps are formed on the surface of the electrode pads.

Method of manufacturing a printed circuit board (PCB)

A porous oxide catalyst includes porous oxide, and an oxygen vacancy-inducing metal which induces an oxygen vacancy in a lattice structure of a porous metal oxide.

Porous oxide catalyst and method of preparing the porous oxide catalyst

A fuel processor includes a reformer that generates hydrogen gas by reacting a fuel source and water; a burner that heats the reformer to a temperature suitable for a hydrogen generation reaction; a CO shift reactor that removes CO generated during the hydrogen generation reaction in the reformer; a heating element for heating the CO shift reactor; and a cooling element for cooling the CO shift reactor, wherein the cooling element comprises at least one of a cooling water flow line for heat exchange with the CO shift reactor when cooling water flows through the cooling water flow line and a cooling gas flow line for heat exchange with the CO shift reactor when a cooling gas, which is a burner exhaust gas that has heat exchanged with cooling water, flows through the cooling gas flow line. When the fuel processor is operated, a stable CO removal performance can be maintained since the temperature of the CO shift reactor can be actively controlled.

Fuel processor having temperature control function for co shift reactor and method of operating the fuel processor

A fuel processor and a fuel cell system which have a desulfurizer with multiple sensors, and a method of measuring an adsorbent state in of an adsorbent the desulfurizer. The desulfurizer determines the saturation state of the adsorbent using a signal difference between at least two sensors installed adjacent to an inlet and an outlet of the desulfurizer. The desulfurizer provides an accurate determination of the saturation of the adsorbent, and can be used to determine when the adsorbent should be changed. Two desulfurizers can be alternatively used to allow for a consistent fuel flow.

Fuel processor having desulfurizer with sulfer sensor, fuel cell system including the fuel processor, and method of operating the fuel cell system

A manufacturing method of a printed circuit board having an electro component is disclosed. The method in accordance with an embodiment of the present invention includes: seating an electro component, in which an electrode is formed on an upper side, on an upper side of a bonding sheet; seating an insulator, in which a cavity corresponding to the electro component has been formed, on the upper side of the bonding sheet; laminating a first insulating resin on an upper side of the insulator such that an upper side of the electro component is covered; polishing the first insulating resin such that the electrode is exposed; and forming a first circuit pattern, which is electrically connected to the exposed electrode, on the polished first insulating resin.

Manufacturing method of printed circuit board having electro component

A fuel reformer, includes: a reformer burner, which generates a flame in a reforming pipe disposed to surround at least the flame of the reformer burner, the reforming pipe being filled with a reforming catalyst and having corrugated portions on a surface facing the reformer burner and a bottom surface of the reforming pipe disposed adjacent to the flame in which a flame blocking member is disposed between the flame of the reformer burner and the reforming pipe to isolate the flame of the reformer burner from the reforming pipe.

Fuel reformer

A PCB having an embedded bare chip includes an insulated substrate having a penetration hole formed therein; a filler filling up an inside of the penetration hole; a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at the surface of the filler; and an electrode bump attached to a surface of the electrode pads and protruded to be exposed to the outside.

Bare chip embedded PCB

A fuel processor having a CO removal unit including an apparatus for warming a CO shifter, is provided. A method of using the fuel processor is also provided. The fuel processor includes a reformer that extracts hydrogen gas from a raw fuel by reacting the raw fuel with water. A burner heats up the reformer to a temperature suitable for extracting the hydrogen gas. A CO shifter removes CO produced during the extraction reaction from the hydrogen gas, and a medium path line in which a heat exchange medium disposed therein absorbs heat from the reformer and passes the heat to the CO shifter. A fuel processor having the above structure can greatly reduce the time required to increases the temperature of the CO shifter to an appropriate operating temperature at an early stage of start up, since a rapid heating of the CO shifter is possible using the heat exchange of steam.

Fuel processor having carbon monoxide removing unit and method of operating the same

A fuel processor having a movable burner, a method of operating the fuel processor, and a fuel cell system having the fuel processor. The fuel processor includes a combustion chamber, a reformer burner, a portion of which is partially disposed inside the combustion chamber, a reformer which is heated by heat transfer from the combustion chamber, and a burner-moving apparatus that moves the reformer burner with respect to the combustion chamber. The method of operating the fuel processor includes determining the load on and a plurality of temperatures within the fuel processor and moving the reformer burner depending upon such information.

Fuel processor having movable burner, method of operating the same, and fuel cell system having the same

A fuel cell system that includes a liquid fuel tank containing a non-sulfur-containing liquid fuel and water; a reformer generating a hydrogen-rich gas from the liquid fuel and water received from the liquid fuel tank; a reformer burner heating the reformer by burning a gaseous fuel received from a gaseous fuel tank, and a fuel cell stack generating electrical energy from the hydrogen-rich gas received from the reformer. The liquid fuel tank is connected to the gaseous fuel tank, and the liquid fuel mixed with water is supplied to the reformer by the pressure of the gaseous fuel tank.

Fuel cell system

A multi-layer printed circuit board and a method of manufacturing the multi-layer printed circuit board using a metal substrate as a core member and having an electronic component embedded in the metal substrate, the method including anodizing the metal substrate such that an anodic oxide layer is formed on upper and lower sides of the metal substrate, respectively; forming an inner layer circuit on upper and lower anodic oxide layers, respectively; etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded; mounting the electronic component in the cavity with a chip bond adhesive; and forming an outer layer circuit on upper and lower sides of the metal substrate, respectively, such that a multi-layer circuit is formed.

Printed circuit board and manufacturing method thereof

A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

Growing community of inventors

Yongin-si, South Korea

Doo-Hwan Lee