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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10553452 B1

PDFFull Text
Date of Patent:
Feb. 04, 2020

Filed:

May. 26, 2016

Printed circuit board, method, and semiconductor package

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Suk-Chang Hong, Cheongju-si, KR;

Hyo-Bin Park, Daejeon, KR;

Dong-Kwang Shin, Daejeon, KR;

Sang-Jin Baek, Sejong, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Matthew L Reames

Assistant Examiner:

Steven B Gauthier

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01); H01L 23/36 (2006.01); H01L 25/10 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 25/105 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48096 (2013.01); H01L 2224/48097 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01);
Abstract

A printed circuit board includes first and second insulating layers forming a cavity, a first heat releasing layer formed on an exterior surface of the cavity, and a circuit layer formed above or below the first the insulating layer and at least between a surface of the cavity and the first insulating layer. The heat releasing layer is electrically connected to at least a portion of the circuit layer.

Find Patent Forward Citations

Hong, Suk-Chang. (2020). Printed circuit board, method, and semiconductor package (U.S. Patent No. 10553452). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10553452

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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