This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: HyeSun Kim: Innovator in Semiconductor Technology
Introduction
HyeSun Kim is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor technology, showcasing his expertise through innovative patents. His work focuses on enhancing the functionality and efficiency of semiconductor devices.
Latest Patents
HyeSun Kim holds a patent for a semiconductor device and method of forming dummy bumps within a saw street. This invention involves a semiconductor wafer or substrate that includes multiple semiconductor die. The patent describes the formation of first bumps over the active surface of the semiconductor wafer and second bumps within the saw street, which separates the semiconductor die. The design ensures that the top surfaces of both the first and second bumps are coplanar, optimizing the device's performance.
Career Highlights
HyeSun Kim is currently employed at Stats Chippac Pte. Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and effective in various applications.
Collaborations
Throughout his career, HyeSun Kim has collaborated with talented colleagues, including KyuWon Lee and Myeongjin Kim. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
HyeSun Kim's contributions to semiconductor technology through his patent and work at Stats Chippac Pte. Ltd. highlight his role as a key innovator in the field. His dedication to advancing semiconductor devices continues to impact the industry positively.