Hyeong-Seob Kim is a prominent inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on improving the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is a semiconductor package apparatus having a redistribution layer. This innovative apparatus includes multiple semiconductor chips, a protective packing part, and a support part. It features external terminals that extend outside the packing part, along with redistribution layers that facilitate the transmission of electrical signals. This design allows for a reduction in size and thickness, simplifying processes and enhancing productivity.

Another notable patent is for a wafer level package and multi-package stack. This semiconductor chip package includes a through hole that extends from the active surface to the inactive surface of the chip. It incorporates a printed circuit board and conductive materials that enhance connectivity and performance.

Career Highlights

Hyeong-Seob Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.

Collaborations

Throughout his career, Hyeong-Seob Kim has collaborated with talented individuals such as Tae-Gyeong Chung and Sa-Yoon Kang. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Hyeong-Seob Kim is a key figure in semiconductor innovation, with a focus on enhancing the efficiency and functionality of semiconductor packages. His contributions continue to shape the future of technology in this field.

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