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Chungcheongnam-do, South Korea

Hyeong-Seob Kim

USPTO Granted Patents = 6

Average Co-Inventor Count = 2.0

ph-index = 4

Forward Citations = 457(Granted Patents)

Location History:

Kyungki-do, KR (1999)
Cheonan, KR (2006 - 2008)
Chungcheongnam-do, KR (2002 - 2012)

Company Filing History:

6 out of 131,214

Samsung Electronics Co., Ltd.

Years Active: 1999-2012

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8129826 - Semiconductor package apparatus having redistribution layer (2012-03-06),

2. 7335592 - Wafer level package, multi-package stack, and method of manufacturing the same (2008-02-26),

3. 7105919 - Semiconductor package having ultra-thin thickness and method of manufacturing the same (2006-09-12),

4. 6982487 - Wafer level package and multi-package stack (2006-01-03),

5. 6448661 - Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof (2002-09-10),

6. 5898226 - Semiconductor chip having a bonding window smaller than a wire ball (1999-04-27),

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