Tongyeong, South Korea

Hyeon Yi Kang

This inventor holds 1 USPTO granted patent. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyeon Yi Kang. Retrieved from https://idiyas.com/inventor/hyeon-yi-kang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Hyeon Yi Kang: Innovator in Integrated Circuit Packaging

Introduction

Hyeon Yi Kang is a notable inventor based in Tongyeong-si, South Korea. He has significantly contributed to the field of integrated circuit packaging, showcasing his innovative abilities through his patented invention.

Latest Patents

Hyeon Yi Kang holds a patent for an "Integrated Circuit Packaging System with Pattern-Through-Mold and Method of Manufacture Thereof." This invention details a sophisticated integrated circuit packaging system characterized by a substrate with a device affixed to its top surface. The innovation involves a mold encapsulating the device, featuring a through via and a recessed pattern formed in a single process. Additionally, the patent outlines a conductive via in the through via and a conductive pattern in the recessed pattern, both of which are established in another single process. This innovative design enhances manufacturing efficiency and product reliability.

Career Highlights

Hyeon Yi Kang is currently associated with Stats Chippac Pte. Ltd., a company known for its pioneering work in semiconductor packaging and testing. His expertise and creativity have propelled advancements in the industry, making significant impacts on product development and technology enhancement.

Collaborations

Throughout his career, Hyeon Yi Kang has collaborated with talented colleagues, including Woo Jin Kim and Sun Jae Kim. These collaborations have fostered a creative environment that cultivates innovation and drives forward-thinking solutions in integrated circuit technology.

Conclusion

Hyeon Yi Kang's contributions to integrated circuit packaging reflect his innovative spirit and dedication to advancing technology. His patent serves as a testament to his skills and ingenuity, paving the way for future developments in the semiconductor industry. As he continues his work at Stats Chippac Pte. Ltd., Hyeon Yi Kang remains a key figure in the pursuit of innovative solutions within the realm of integrated circuits.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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