Hwan Pil Park

Title: Hwan Pil Park: Innovator in Semiconductor Technology

Introduction

Hwan Pil Park is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His work focuses on innovative semiconductor packages and methods of fabrication.

Latest Patents

Hwan Pil Park's latest patents include a semiconductor package and a method of fabricating the same. This semiconductor package features a substrate with a first insulating layer and a first conductive pattern, along with a first semiconductor chip. Additionally, it incorporates an interposer that is spaced apart from the first semiconductor chip, which includes a second insulating layer and a second conductive pattern. Another notable patent is for a semiconductor package that includes a support solder ball. This package consists of a first substrate and a first semiconductor device, with a support solder ball positioned between the first substrate and a second substrate, ensuring electrical disconnection from either substrate.

Career Highlights

Throughout his career, Hwan Pil Park has worked with prominent companies, including Samsung Electronics Co., Ltd. and the Industry-University Cooperation Foundation at Hanyang University. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Hwan Pil Park has collaborated with notable individuals in his field, including Jongbo Shim and Jong Bo Shim. These collaborations have contributed to the advancement of his research and inventions.

Conclusion

Hwan Pil Park is a distinguished inventor whose work in semiconductor technology has led to multiple patents and significant advancements in the industry. His contributions continue to influence the field and inspire future innovations.