The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
May. 04, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Young-Ho Kim, Seoul, KR;
Hwan Pil Park, Hwaseong-si, KR;
Sung-Chul Kim, Asan-si, KR;
Key-One Ahn, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIV, Seoul, KR;
Abstract
A semiconductor package includes: a substrate; a semiconductor chip disposed on a first surface of the substrate; solder bumps disposed between a first surface of the semiconductor chip and the substrate; and a redistribution layer provided on a second surface, opposite to the first surface, of the semiconductor chip. The substrate includes substrate patterns, and the substrate patterns cover a second surface of the substrate. The substrate patterns cover 60% to 100% of a total area of the second surface of the substrate.