This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Hung Yi Chuang
Introduction
Hung Yi Chuang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging. His work focuses on enhancing the efficiency and functionality of electronic components.
Latest Patents
Hung Yi Chuang holds a patent for a "Package structure and method of manufacturing the same." This innovative package structure includes an electronic component and a first connection element. The electronic component features a conductive wire encapsulated by a magnetic layer. The first connection element is electrically connected to the conductive wire and is positioned outside the magnetic layer. This design aims to improve the performance and reliability of electronic devices.
Career Highlights
Hung Yi Chuang is currently employed at Advanced Semiconductor Engineering, Inc. His role involves developing advanced packaging solutions that cater to the evolving needs of the semiconductor industry. His expertise in this area has positioned him as a valuable asset to his company.
Collaborations
Hung Yi Chuang has collaborated with esteemed colleagues such as Wu Chou Hsu and Shin-Luh Tarng. These partnerships have fostered innovation and have contributed to the successful development of new technologies in the semiconductor field.
Conclusion
Hung Yi Chuang's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to advancing technology. His work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile