The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Feb. 24, 2023
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01B 1/20 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 5/00 (2006.01); H05K 1/183 (2026.01); H05K 1/185 (2026.01);
U.S. Cl.
CPC ...
H01B 1/20 (2013.01); H05K 1/0233 (2013.01); H05K 1/115 (2013.01); H05K 5/0026 (2013.01); H05K 1/111 (2013.01); H05K 1/183 (2013.01); H05K 1/185 (2013.01);
Abstract
A package structure and a method of manufacturing the same are provided. The package structure includes an electronic component and a first connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The first connection element is electrically connected to the conductive wire. The first connection element is disposed outside the magnetic layer.