This inventor holds 5 USPTO granted patents. Top assignees: Chipmos Technologies Inc., Chipmos Technologies (Bermuda) Ltd. Active years: 2009-2011.
Company Filing History:
5 out of 178 
4 out of 85 Years Active: 2009-2011
Title: Innovations of Inventor Hung-Tsun Lin
Introduction
Hung-Tsun Lin is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
Among his latest patents is a BGA package with leads on chip. This innovative package includes a leadless leadframe with multiple leads, a chip, a die-attaching layer, bonding wires, an encapsulant, and solder balls. The design ensures that each lead has a bottom surface with a wire-bonding area and a ball-placement area, enhancing the overall functionality of the package. Another significant patent is for a leadless semiconductor package with an electroplated layer embedded in the encapsulant. This package features a half-etched leadframe and an electroplated layer that improves thermal dissipation and reduces costs, making it a valuable advancement in semiconductor technology.
Career Highlights
Hung-Tsun Lin has worked with prominent companies in the semiconductor industry, including Chipmos Technologies Inc. and Chipmos Technologies (Bermuda) Ltd. His experience in these organizations has contributed to his expertise in semiconductor packaging and innovation.
Collaborations
He has collaborated with notable colleagues such as Wu-Chang Tu and Cheng-Ting Wu, further enhancing his contributions to the field.
Conclusion
Hung-Tsun Lin's innovative patents and career achievements reflect his dedication to advancing semiconductor technology. His work continues to influence the industry and pave the way for future innovations.