This inventor holds 3 USPTO granted patents and 4 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations by Inventor Hung-Pin Chang
Introduction
Hung-Pin Chang is an inventor based in Taipei, Taiwan. He is known for his contributions to the field of semiconductor technology. Although he currently holds no granted patents, he has been actively involved in developing innovative methods and applications.
Latest Patent Applications
Hung-Pin Chang's latest patent applications include:
1. **FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF** - This method involves etching a portion of a wafer to create a first trench in a scribe line between two device dies. The process includes a laser grooving technique to form a second trench, which is essential for the die-saw process that separates the device dies.
2. **SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD** - This application describes a package that includes an integrated circuit die and an interposer. The design features dielectric-to-dielectric bonds and ensures that the integrated circuit die overlaps the first seal ring, enhancing the structural integrity of the package.
Conclusion
Hung-Pin Chang continues to push the boundaries of semiconductor technology through his innovative patent applications. His work reflects a commitment to advancing the field, even in the absence of granted patents.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile