Hung-Ming Su

Title: Innovations of Inventor Hung-Ming Su

Introduction

Hung-Ming Su is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology. With a total of two patents to his name, his work focuses on enhancing semiconductor structures and their manufacturing processes.

Latest Patents

Hung-Ming Su's latest patents include a semiconductor structure and a manufacturing method thereof, as well as a method for detecting short circuits within these structures. The semiconductor structure comprises a substrate, at least two tested structures, an isolation structure, and a short-circuit detection structure. The tested structures, which include a conductive material, are positioned on the substrate, with the isolation structure sandwiched between them. The detection structure features a detecting layer that is placed on one of the tested structures, allowing for the identification of short circuit defects during an electron beam detecting process. Additionally, he has developed a layout for measuring overlapping states, which includes a layout region, a first dummy active area region, and dummy component regions.

Career Highlights

Hung-Ming Su is currently employed at Winbond Electronics Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor manufacturing.

Collaborations

Some of his coworkers include Chun-Chiao Tseng and Kazuaki Takesako, who contribute to the collaborative efforts in their projects.

Conclusion

Hung-Ming Su's contributions to semiconductor technology through his patents and work at Winbond Electronics Corporation highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of semiconductor manufacturing.