Hung-hsin Hsu

Title: Innovations of Hung-hsin Hsu in Semiconductor Technology

Introduction

Hung-hsin Hsu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique fan-out semiconductor package, which showcases his expertise and creativity in this domain.

Latest Patents

Hung-hsin Hsu holds a patent for a fan-out semiconductor package and method for manufacturing the same. This patent includes a detailed description of a fan-out semiconductor package that consists of a redistribution structure, a functional chip coupled to the redistribution structure, and an isolation structure with through-holes. Additionally, it features a shielding structure, a first conductive pattern structure, an encapsulating structure, and a second conductive pattern structure. The method for manufacturing this fan-out semiconductor package is also disclosed in the patent.

Career Highlights

Hung-hsin Hsu is currently employed at Powertech Technology Inc., a leading company in the semiconductor industry. His work at Powertech has allowed him to further develop his skills and contribute to cutting-edge technologies in semiconductor packaging.

Collaborations

Throughout his career, Hung-hsin Hsu has collaborated with talented individuals such as Shang-yu Chang Chien and Nan-Chun Lin. These collaborations have enriched his work and fostered innovation in semiconductor technology.

Conclusion

Hung-hsin Hsu's contributions to the semiconductor industry, particularly through his patented innovations, highlight his role as a key inventor in this field. His work continues to influence advancements in semiconductor packaging technology.