Pingtung, Taiwan

Hung-Chun Lee

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: United Microelectronics Corp.. Active years: 2021.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations of Hung-Chun Lee

Introduction

Hung-Chun Lee is a notable inventor based in Pingtung, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method for fabricating shallow trench isolation.

Latest Patents

Hung-Chun Lee holds a patent for a "Method for fabricating shallow trench isolation." This method involves several steps, including forming a trench in a substrate, creating a pad layer adjacent to the trench, filling the trench with a dielectric layer, and performing a dry etching process. The dry etching process is particularly noteworthy as it comprises a non-plasma etching process, which enhances the efficiency of semiconductor device fabrication. He has 1 patent to his name.

Career Highlights

Hung-Chun Lee is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work focuses on advancing semiconductor fabrication techniques, which are crucial for the development of modern electronic devices.

Collaborations

Some of his notable coworkers include Bin-Siang Tsai and Shu-Ming Yeh. Their collaborative efforts contribute to the innovative projects at United Microelectronics Corporation.

Conclusion

Hung-Chun Lee's contributions to semiconductor technology through his patented methods demonstrate his expertise and commitment to innovation. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
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