Hung-Chou Liao

Title: Innovations by Inventor Hung-Chou Liao

Introduction

Hung-Chou Liao is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His work focuses on the development of advanced semiconductor devices and manufacturing methods.

Latest Patents

Hung-Chou Liao holds a patent for a semiconductor device and its manufacturing method. The patent describes a semiconductor device that includes a redistribution layer (RDL) module, a first semiconductor module, an interconnection module, a second semiconductor module, and a molding material. The first semiconductor module is positioned on the RDL module, while the interconnection module is also placed on the RDL module. The second semiconductor module is situated on the interconnection module. The molding material encapsulates the RDL module and surrounds both the first and second semiconductor modules. Notably, the top surfaces of both semiconductor modules are exposed by the molding material. This innovative design enhances the functionality and efficiency of semiconductor devices.

Career Highlights

Hung-Chou Liao is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to contribute to cutting-edge technologies and advancements in semiconductor manufacturing.

Conclusion

Hung-Chou Liao's innovations in semiconductor technology exemplify the importance of research and development in this field. His patent reflects a significant advancement that could influence future semiconductor designs and applications.