Tainan, Taiwan

Hui-Ting Lin

USPTO Granted Patents = 6 

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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6 patents (USPTO):Explore Patents

Title: Hui-Ting Lin: Innovator in Semiconductor Packaging

Introduction

Hui-Ting Lin, a prominent inventor based in Tainan, Taiwan, has made significant contributions to the field of semiconductor packaging. With a total of five patents to his name, Lin's innovations demonstrate his commitment to advancing technology and improving semiconductor device efficiency.

Latest Patents

One of Hui-Ting Lin's latest patents is a **semiconductor package structure having a ring portion with recess for adhesive**. This inventive package structure includes components such as a substrate, a cover element, a semiconductor device, a protruding element, an adhesive element, and an electrical connector. The design features a cover element with a recess that enables improved adhesion and functionality of the semiconductor device.

Another notable innovation is the **bonding tool and bonding method thereof**. This method involves a sophisticated bonding tool that integrates a bending member, which is crucial for attaching a semiconductor die to the bonding surface. Lin’s technique facilitates a two-step bonding process, which enhances the reliability and performance of semiconductor connections.

Career Highlights

Hui-Ting Lin currently works for Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading institution in the semiconductor industry. His role within this prestigious company has allowed him to be at the forefront of semiconductor innovations, contributing to critical advancements in packaging technologies.

Collaborations

Throughout his career, Lin has collaborated with esteemed colleagues such as Chin-Fu Kao and Chen-Shien Chen. Their collective expertise has fostered an environment of innovation and technological progress within their projects, ultimately leading to successful patent applications that enhance the semiconductor landscape.

Conclusion

In summary, Hui-Ting Lin's contributions to semiconductor packaging underscore his role as an influential inventor. With five patents highlighting his innovative spirit, Lin continues to shape the industry through novel solutions and collaborative efforts at TSMC. His work not only enhances the functionality of semiconductor devices but also sets the stage for future advancements in technology.

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