The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Aug. 31, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A package structure is provided. The package structure includes a substrate, a cover element, a semiconductor device, a protruding element, and an adhesive element. The cover element is disposed on the substrate and having a ring portion, a space is surrounded by the ring portion, and a recess is formed on a surface of the ring portion that faces the substrate. The semiconductor device is disposed on the substrate and disposed in the space surrounded by the ring portion, wherein the semiconductor device is spaced apart from the recess by the ring portion. The protruding element extends from the substrate and disposed in the recess. The adhesive element is disposed in the recess, wherein in a top view, the semiconductor device is surrounded by the protruding element.