Bayan Lepas, Malaysia

Hui Hui Ngu

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hui Hui Ngu. Retrieved from https://idiyas.com/inventor/hui-hui-ngu-6qaj6yo7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Innovations of Hui Hui Ngu

Introduction

Hui Hui Ngu is a notable inventor based in Bayan Lepas, Malaysia. He has made significant contributions to the field of integrated circuit design. His work focuses on enhancing the functionality and configurability of electronic components.

Latest Patents

Hui Hui Ngu holds a patent for a "Configurable first in first out and deserializer circuitry." This innovative integrated circuit device features a single via layer that includes selectable via sites and/or jumpers. The design allows for the configuration and interconnection of components and circuitry across distinct layers of multilayer circuits. By selectively enabling via sites, such as through filling via openings or using jumpers, the device can form either a deserializer circuit or a first-in first-out (FIFO) circuit.

Career Highlights

Hui Hui Ngu is currently employed at Intel Corporation, where he continues to push the boundaries of technology. His work at Intel has allowed him to collaborate with other talented engineers and contribute to cutting-edge projects in the semiconductor industry.

Collaborations

One of his notable coworkers is Eah Loon Alan Chuah. Together, they work on various projects that aim to innovate and improve integrated circuit technologies.

Conclusion

Hui Hui Ngu's contributions to the field of integrated circuits exemplify the spirit of innovation. His patent and work at Intel Corporation highlight his commitment to advancing technology in meaningful ways.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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