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Gyunggi-do, South Korea

Hueng Jae Oh

USPTO Granted Patents = 8 (Patent Applications = 2)

Average Co-Inventor Count = 3.7

ph-index = 2

Forward Citations = 10(Granted Patents)

Location History:

Suwon-si, KR (2011)
Gyunggi-do, KR (2013 - 2014)
Gyeonggi-do, KR (2014)
Suwon, KR (2014 - 2015)

Company Filing History:

Samsung Electro-mechanics Co., Ltd.

Years Active: 2011-2015

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9142499 - Lead pin for package substrate (2015-09-22),

2. 8785789 - Printed circuit board and method for manufacturing the same (2014-07-22),

3. 8766450 - Lead pin for package substrate (2014-07-01),

4. 8708215 - Solder ball supplying apparatus (2014-04-29),

5. 8671564 - Substrate for flip chip bonding and method of fabricating the same (2014-03-18),

6. 8651356 - Solder bump forming apparatus and soldering facility including the same (2014-02-18),

7. 8486760 - Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same (2013-07-16),

8. 7893355 - Lead pin for package boards (2011-02-22),

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