The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2013
Filed:
Sep. 29, 2010
Tae Joon Chung, Seoul, KR;
Jin Won Choi, Gyunggi-do, KR;
Dong Gyu Lee, Gyunggi-do, KR;
Hueng Jae OH, Gyunggi-do, KR;
Seon Jae Mun, Gyunggi-do, KR;
Tae Joon Chung, Seoul, KR;
Jin Won Choi, Gyunggi-do, KR;
Dong Gyu Lee, Gyunggi-do, KR;
Hueng Jae Oh, Gyunggi-do, KR;
Seon Jae Mun, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.