The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Jun. 11, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Ki Taek Lee, Seoul, KR;
Hueng Jae Oh, Suwon, KR;
Sung Won Jeong, Yongin, KR;
Gi Sub Lee, Busan, KR;
Jin Won Choi, Yongin, KR;
Assignee:
SAMSUNG ELECTRO-MACHANICS CO., LTD., Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/49805 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/09701 (2013.01);
Abstract
A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.