Huan-Yi Liao

Title: Huan-Yi Liao: Innovator in Circuit Board Technology

Introduction

Huan-Yi Liao is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of circuit board technology. His innovative designs have led to the development of advanced circuit board devices that enhance electronic performance.

Latest Patents

Huan-Yi Liao holds a patent for a circuit board device and its circuit module. This invention features a multilayer board structure that includes a main ground. The circuit module consists of two differential-signal portions located on a core layer of the multilayer board structure. Each differential-signal portion includes a differential through-hole pair and several ground through holes, which are arranged to surround the differential through-hole pair and connect to the main ground. The design of the differential-signal portions is mirror symmetrical, ensuring optimal performance.

Career Highlights

Throughout his career, Huan-Yi Liao has worked with prominent companies in the semiconductor industry. He has been associated with Global Unichip Corporation and Taiwan Semiconductor Manufacturing Company Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies.

Collaborations

Huan-Yi Liao has collaborated with esteemed colleagues such as Sheng-Fan Yang and Chi-Lou Yeh. These partnerships have fostered innovation and have been instrumental in the development of new technologies in the field.

Conclusion

Huan-Yi Liao is a distinguished inventor whose work in circuit board technology has made a lasting impact. His patent and collaborations reflect his commitment to advancing electronic design. His contributions continue to influence the industry and inspire future innovations.