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For the Inventor, By the Inventor

Mendenhall, PA, United States of America

Hua-Feng Huang

This inventor holds 11 USPTO granted patents. Top assignees: E.i. Dupont De Nemours and Company, Campbell Soup Company. Active years: 1977-1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hua-Feng Huang. Retrieved from https://idiyas.com/inventor/hua-feng-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 11

% Patents Active = 100.0

Average Co-Inventor Count = 1.7

ph-index = 8

Forward Citations = 251(Granted Patents)


Location History:

  • Mendenhall, PA (US) (1977 - 1992)
  • Chadds Ford, PA (US) (1984 - 1994)

Company Filing History:

goldMedal11 out of 16,339 
 
E.i. Dupont De Nemours and Company
 patents
silverMedal1 out of 162 
 
Campbell Soup Company
 patents
where one patent can have more than one assignee

Years Active: 1977-1994

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11 patents (USPTO):Explore Patents
1. 5376446 - Electrically dissipative composite (1994-12-27),
2. 5175239 - Process for making para-aramid fibers having high tenacity and modulus (1992-12-29),
3. 5146058 - Microwave resonant cavity applicator for heating articles of indefinite (1992-09-08),
4. 5091229 - Electronics protective packaging film (1992-02-25),
5. 5021293 - Composite material containing microwave susceptor material (1991-06-04),
6. 4985300 - Shrinkable, conformable microwave wrap (1991-01-15),
7. 4935252 - Microwave oven preparation of waffle (1990-06-19),
8. 4892782 - Fibrous microwave susceptor packaging material (1990-01-09),
9. 4833007 - Microwave susceptor packaging material (1989-05-23),
10. 4446348 - Serpentine microwave applicator (1984-05-01),
11. 4056638 - Dielectric drying of fungal material and resultant textured product (1977-11-01),

Title: Innovations of Hua-Feng Huang

Introduction

Hua-Feng Huang is a notable inventor based in Mendenhall, PA (US), recognized for his contributions to materials science and engineering. He holds a total of 11 patents, showcasing his innovative spirit and technical expertise in developing advanced materials.

Latest Patents

Huang's latest patents include an Electrically Dissipative Composite, which is a heat-sealable, oil-resistant, static-dissipative packaging composite. This composite consists essentially of 95.5-97.5 wt % ionomer and 4.5-2.5 wt % electroconductive carbon powder, making it particularly useful for protective packaging of electrostatic sensitive electronic components and assemblies. Another significant patent is for a Process for Making Para-Aramid Fibers Having High Tenacity and Modulus. This process involves heating never-dried para-aramid fibers containing 20 to 200 wt % water to form fibers with a modulus greater than 800 gpd while retaining high tenacity.

Career Highlights

Hua-Feng Huang has worked with prominent companies such as E.I. DuPont De Nemours and Company and Campbell Soup Company. His experience in these organizations has contributed to his development of innovative materials and processes.

Collaborations

Huang has collaborated with notable individuals in his field, including Walter A. Wallace and John R. Fisher. These collaborations have likely enriched his work and led to further advancements in his research.

Conclusion

Hua-Feng Huang's innovative contributions to materials science are evident through his patents and career achievements. His work continues to impact the field, particularly in the development of advanced packaging materials and fibers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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