E.i. Dupont De Nemours and Company

Campbell Soup Company

Hua-Feng Huang

Walter A Wallace

John R Fisher

Frederick E Simon

Sibbley Paul Gauntt

Richard A Yates

Ralph C Golike

Richard W Lewis

Donald E Plorde

Dean R Herfindahl

Herminio C Llevat

A heat-sealable, oil-resistant, static-dissipative packaging composite consisting essentially of 95.5-97.5 wt % ionomer and 4.5-2.5 wt % electroconductive carbon powder having a surface area of 1000-1500 m.sup.2 /gm and a pore volume of 480-510 ml/100 gm. The composite is useful for protective packaging of electrostatic sensitive electronic components and assemblies.

Electrically dissipative composite

A process is disclosed for heating never-dried para-aramid fibers containing 20 to 200 wt % water, based on dry polymer weight to form a fiber having a modulus of greater than 800 gpd while retaining a high tenacity. The fibers are heated in one or more microwave resonant cavity applicators to a temperature of 250.degree. C. to 425.degree. C. and preferably 270.degree. C. to 310.degree. C. while under a tension of 0.2 to 10 grams per denier. The preferred para-aramid is poly(p-phenylene terephthalamide). Fibers having a density of less than 1.43 g/cc can be made; and fibers having moduli greater than 1100 gpd can be made.

Process for making para-aramid fibers having high tenacity and modulus

A rectangular microwave resonant cavity applicator comprising two spaced-apart, cavity-containing sections is disclosed for heating a product web. Each section has a planar peripheral lip which faces the other and the sections are spaced apart by a distance 'd'. The lips have arrays of ferrite segments mounted on their surfaces which serve to limit radiation of microwave energy from the open space between the sections, through which the product web passes.

Microwave resonant cavity applicator for heating articles of indefinite

Packages prepared from a flexible static charge-dissipating structure comprising a substrate film, a coating layer of heat sealable thermoplastic matrix containing micron sized particles of a silica containing material surface coated with antimony-containing tin oxide crystallites, and optionally a thin layer of metal, provide excellent static charge protection to sensitive electronic components.

Electronics protective packaging film

A composite material useful for controlled generation of heat by absorption of microwave energy is disclosed. The material comprises a dielectric substrate, e.g., polyethylene terephthalate film, coated with a mixture of an electrically conductive metal or metal alloy in flake form in a thermoplastic dielectric matrix, e.g., a polyester copolymer. In a preferred embodiment, the coating of flake/thermoplastic is applied so as to yield an isotropic coating with good heating performance reproducibility. The use of circular flakes with flat surfaces and smooth edges contributes substantially to good heating performance reproducibility.

Composite material containing microwave susceptor material

A heat shrinkable film is useful for packaging and for cooking a food item in a microwave oven is provided, which comprises a layer of flexible, heat resistant, microwave transparent base film which exhibits shrinkage of at least about 10% when heated unrestrained to 100.degree. C. for 5 seconds, and a layer of microwave susceptor material extending over the base film in an amount sufficient to cause the film to heat under microwave cooking conditions to provide browning or crisping of the food item.

Shrinkable, conformable microwave wrap

A package for cooking a waffle in a microwave oven is provided, comprising a microwave transparent tray about 28 to 38 mm deep, a lossy susceptor film lid having defined reflectance and absorbance, placed about 3 to about 10 mm over the waffle, providing means for moisture to escape. The waffle is coated with an edible food conditioner, to provide improved microwave susceptibility to the surfaces of the waffle. The waffle may be cooked alone or in the presence of a sausage side dish.

Microwave oven preparation of waffle

New composite materials useful for wrapping food items to be cooked by microwave energy comprise drapable, liquid permeable, woven or non-woven, fibrous dielectric substrates, which substrates, or fibers of which substrates, are coated and/or imbibed with one or more susceptor materials. The composite materials, when wrapped around a food item to be cooked by microwave energy, enhance the browning and/or crispening of the items.

Fibrous microwave susceptor packaging material

New composite materials useful for wrapping food items to be cooked by microwave energy comprise a dielectric substrate substantially transparent to microwave energy which substrate is coated and/or imbibed with one or more microwave susceptor materials, the type and amount of said susceptor material or materials being adequate to allow said materials to absorb a portion of both the electric and the magnetic field components of said microwave energy and convert said energy to heat to rapidly brown or crispen the surface of the food item adjacent thereto without substantially impeding the ability of the microwave energy to penetrate the susceptor material and cook the food item.

Microwave susceptor packaging material

A serpentine microwave applicator for drying aqueous coatings on polymeric webs. Successive waveguides are coupled by enlarged, inverted, rectangular apertures. With such apertures, normal changes in load have minimal adverse effects on energy utilization.

Serpentine microwave applicator

A proteinaceous mass of fungal mycelial fibers is treated by rapid dielectric heating to reduce the moisture content by from 8 to 40 weight percent to give a product with a solids level of 30 to 70 weight percent, and preferably a solids level of 40 to 60 weight percent. The initial proteinaceous mass may be pretreated such as by aqueous thermal shock to reduce the nucleic acid content, before it is formed into fiber bundles of from 0.2 to 1.0 mm. in diameter, and having an average length to diameter ratio of greater than 20. These bundles are interconnected by groups of hyphae or by single hyphal with average diameter of from 0.004 to 0.01 mm. and length to diameter ratio of from 10 to 1000. The dielectric heating process puffs and crosslinks (heat sets) the product which then may be further dried such as in a hot air oven to reduce the moisture content of the mass to the desired level below 10 weight percent. The product is rehydratable to 1 to 5 and preferably 1.5 to 3.0 times its dry weight to yield a form having a texture and chewability resembling meat.

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Mendenhall, PA, United States of America

Hua-Feng Huang