Hsueh-Shun Yeh

Title: Hsueh-Shun Yeh: Innovator in Flip Chip Bonding Technology

Introduction

Hsueh-Shun Yeh is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of flip chip bonding methods. His innovative approach has led to advancements that enhance the performance and reliability of electronic devices.

Latest Patents

Hsueh-Shun Yeh holds a patent for a "Flip chip bonding method and chip used therein." This patent describes a bonding process where a chip is attached to contact pads of a substrate using composite bumps. Each bump consists of a raiser, a UBM layer, and a bonding layer. The method emphasizes reducing electrical impedance between the chip and the substrate by ensuring that the bonding surface has a greater area than the surface to be bonded.

Career Highlights

Yeh is associated with Chipbond Technology Corporation, where he applies his expertise in semiconductor manufacturing. His work has been instrumental in developing efficient bonding techniques that are crucial for modern electronic applications.

Collaborations

Some of his notable coworkers include Fei-Jain Wu and Sheng-Jen Wu, who collaborate with him on various projects within the company.

Conclusion

Hsueh-Shun Yeh's contributions to flip chip bonding technology exemplify his innovative spirit and dedication to advancing semiconductor technology. His patent reflects a significant step forward in improving the efficiency of electronic devices.