Company Filing History:
Years Active: 2012-2013
Title: Hsu-Yang Lee: Innovator in Semiconductor Packaging
Introduction
Hsu-Yang Lee is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative designs and methods.
Latest Patents
One of Hsu-Yang Lee's latest patents is for a semiconductor package having a cavity structure. This invention describes a package that includes a die pad, a plurality of leads, a chip, and a package body. The die pad features a peripheral edge region that defines a cavity with a cavity bottom, which includes a central portion. The design incorporates an upper sloped portion and a lower sloped portion. The chip is positioned on the central portion of the cavity bottom and is connected to the leads. The package body is formed over the chip and leads, filling the cavity and covering the upper sloped portions of the die pad and leads. The lower sloped portions extend outwardly from the lower surface of the package body.
Another notable patent by Hsu-Yang Lee is for an advanced quad flat no lead chip package that includes a protective layer to enhance surface mounting and manufacturing methods. This package also consists of a die pad, multiple leads, a chip, a package body, and a protective layer. Similar to his previous invention, the die pad has an upper sloped portion, a lower sloped portion, and a peripheral edge region defining a cavity. The protective layer covers the lower sloped portion and the lower surface of at least one lead, ensuring improved functionality.
Career Highlights
Hsu-Yang Lee is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative semiconductor solutions. His work has significantly impacted the efficiency and effectiveness of semiconductor packaging technologies.
Collaborations
Hsu-Yang Lee collaborates with talented individuals such as Chien-Wen Chen and Pao-Huei Chang Chien, contributing to advancements in semiconductor technology.
Conclusion
Hsu-Yang Lee is a distinguished inventor whose work in semiconductor packaging has led to innovative solutions that enhance manufacturing processes. His contributions are vital to the ongoing evolution of semiconductor technology.