The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Aug. 15, 2008
Pao-huei Chang Chien, Fengshan, TW;
Ping-cheng HU, Kaohsiung, TW;
Chien-wen Chen, Kaohsiung, TW;
Hsu-yang Lee, Tainan, TW;
Pao-Huei Chang Chien, Fengshan, TW;
Ping-Cheng Hu, Kaohsiung, TW;
Chien-Wen Chen, Kaohsiung, TW;
Hsu-Yang Lee, Tainan, TW;
Advanced Semiconductor Engineering, Inc., Kaosiung, TW;
Abstract
A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a plurality of leads, a chip, and a package body. The die pad includes: (1) a peripheral edge region defining, a cavity with a cavity bottom including a central portion; (2) an upper sloped portion; and (3) a lower sloped portion. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the central portion of the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body.