Chien-Wen Chen

Title: Innovations by Chien-Wen Chen in Semiconductor Packaging

Introduction

Chien-Wen Chen is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on innovative designs that enhance the functionality and efficiency of semiconductor packages.

Latest Patents

One of his latest patents is for a semiconductor package having a cavity structure. This invention describes a package that includes a die pad, a plurality of leads, a chip, and a package body. The die pad features a peripheral edge region that defines a cavity with a cavity bottom, which includes a central portion. The design incorporates an upper sloped portion and a lower sloped portion for optimal performance. The chip is positioned on the central portion of the cavity bottom and is connected to the leads, while the package body is formed over the chip and leads, effectively filling the cavity.

Another significant patent by Chen is for an advanced quad flat no lead chip package that includes marking and corner lead features. This package consists of a die pad, a first plurality of leads arranged around the die pad, and a second plurality of leads located in the corner regions. The semiconductor chip is mounted on the die pad and is coupled to each lead. The design ensures that the lower sloped portions of the leads extend outwardly from the lower surface of the package body, enhancing its structural integrity.

Career Highlights

Chien-Wen Chen is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packages, making them more efficient and reliable.

Collaborations

Throughout his career, Chen has collaborated with several talented individuals, including Pao-Huei Chang Chien and Ping-Cheng Hu. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Chien-Wen Chen's contributions to semiconductor packaging through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry, paving the way for future innovations in semiconductor design.