Hsinchu, Taiwan

Hsu Chun Yuan

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsu Chun Yuan. Retrieved from https://idiyas.com/inventor/hsu-chun-yuan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Hsu Chun Yuan and His Semiconductor Processing Patent.

Introduction

Hsu Chun Yuan is an inventor based in Hsinchu, Taiwan. His patent work concerns wafer processing and the design of alloy susceptors used in film deposition. He is associated with Taiwan Semiconductor Manufacturing Company Limited.

Latest Patents

The provided information lists one patent for Hsu Chun Yuan: “Method of Making and Using Alloy Susceptor with Improved Properties for Film Deposition.” The patent describes processing a wafer using an alloy susceptor with an exterior surface and a wafer-contact surface. The exterior surface is roughened and coated with ceramic material before the susceptor is placed in a wafer process chamber. Film layers are then deposited on the ceramic-coated surface. The described approach aims to improve adhesion between the deposited film and the susceptor surface compared with a non-roughened surface without the ceramic coating. The supplied data reports 1 patent.

Career Highlights

Hsu Chun Yuan’s listed invention addresses surface preparation and coating in semiconductor manufacturing. By combining surface roughening with a ceramic coating, the method is designed to strengthen film adhesion on an alloy susceptor during wafer processing.

Collaborations

The supplied information names Ming Jie He and Steven Li as coworkers. Their specific roles in the patent or related work are not provided.

Conclusion

Hsu Chun Yuan’s listed patent focuses on improving film adhesion through a roughened, ceramic-coated alloy susceptor, reflecting an application of materials and surface engineering to semiconductor processing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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