This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Integrated Silicon Solution Incorporated. Active years: 2023-2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023-2024
Title: Hsingya Arthur Wang: Innovator in Wafer-Bonding and FinFET Technologies
Introduction
Hsingya Arthur Wang is a notable inventor based in Milpitas, CA (US). He has made significant contributions to the field of semiconductor technology, particularly in wafer-bonding structures and FinFET stack gate memory. With a total of 2 patents, his work has advanced the capabilities of modern electronics.
Latest Patents
Wang's latest patents include a method for forming a wafer-bonding structure. This method involves a wafer-bonding step, a through silicon via (TSV) forming step, and a bonding pad formation step. In the wafer-bonding step, at least two wafers are bonded together by their surfaces. The TSV forming step includes creating a TSV structure on one side of a seal ring structure, with a conductive filler placed within the TSV. The bonding pad is then formed on the outer surface of the wafer, completing the wafer-bonding structure.
Another significant patent is for a method of forming a FinFET stack gate memory. This process includes several steps, such as forming a nitride film on a memory cell area, stripping a portion of the nitride film, and forming a floating gate structure. The method also involves disposing of an oxide-nitride-oxide (ONO) layer and forming a control gate structure, showcasing Wang's innovative approach to memory technology.
Career Highlights
Hsingya Arthur Wang is currently employed at Integrated Silicon Solution Incorporated, where he continues to push the boundaries of semiconductor innovation. His expertise in wafer-bonding and FinFET technologies has positioned him as a key player in the industry.
Collaborations
Wang has collaborated with talented coworkers such as Sheng-Yuan Chou and Yu-Ting Wang. Their combined efforts have contributed to the advancement of semiconductor technologies and innovations.
Conclusion
Hsingya Arthur Wang is a distinguished inventor whose work in wafer-bonding and FinFET technologies has made a significant impact on the semiconductor industry. His patents reflect a commitment to innovation and excellence in technology development.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile