Hsing Kuo Tien

Title: Hsing Kuo Tien: Innovator in Semiconductor Packaging

Introduction

Hsing Kuo Tien is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 17 patents. His innovative designs and methods have advanced the technology used in electronic devices.

Latest Patents

Among his latest patents are a package substrate and an electronic device package, along with a method for manufacturing the same. The package substrate includes a substrate, an electronic component, and a conductive trace. The electronic component features a magnetic layer and a conductive wire, with specific design elements that enhance its functionality. Another notable patent involves a semiconductor device package that includes a stress buffering layer, which is crucial for maintaining the integrity of electronic components under stress.

Career Highlights

Hsing Kuo Tien works at Advanced Semiconductor Engineering, Inc., where he has been instrumental in developing cutting-edge packaging solutions. His work has not only improved the performance of electronic devices but has also contributed to the overall efficiency of semiconductor manufacturing processes.

Collaborations

He collaborates with talented coworkers such as Chih-Cheng Lee and Wu Chou Hsu, further enhancing the innovative environment at his company.

Conclusion

Hsing Kuo Tien's contributions to semiconductor packaging exemplify the impact of innovation in technology. His patents reflect a commitment to advancing electronic device performance and reliability.