Hsinchu, Taiwan

Hsing-Hung Lee

This inventor holds 2 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2004-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsing-Hung Lee. Retrieved from https://idiyas.com/inventor/hsing-hung-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 5(Granted Patents)


Location History:

  • Chiai, TW (2004)
  • Hsinchu, TW (2007)

Company Filing History:


Years Active: 2004-2007

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2 patents (USPTO):Explore Patents

Title: Innovations by Hsing-Hung Lee in Semiconductor Manufacturing

Introduction

Hsing-Hung Lee, a notable inventor based in Hsinchu, Taiwan, has contributed significantly to the field of semiconductor manufacturing. With two patents to his name, Lee has developed innovative solutions that enhance manufacturing processes and safety protocols within wafer fabrication plants.

Latest Patents

Hsing-Hung Lee's latest innovations include two pivotal patents aimed at improving efficiency and safety in semiconductor manufacturing. The first patent, titled "System and method for integrating a dispatching system with multiple process lines in a semiconductor manufacturing environment," outlines an automated method for tracking lots as they move between manufacturing lines. This system employs state assignment to indicate the lot's position and employs trigger events to reflect its transition between the lines.

The second patent, "Seismic emergency response system for use in a wafer fabrication plant," introduces a comprehensive system designed to minimize damage during seismic events. This invention consists of a facility manager control system integrated with seismic detection devices. When an earthquake is detected, the system issues commands to halt equipment operations and protect delicate wafers from damage, thus enhancing overall safety in manufacturing environments.

Career Highlights

Hsing-Hung Lee currently works at Taiwan Semiconductor Manufacturing Company Limited (TSMC), one of the largest and most advanced semiconductor manufacturers in the world. His expertise in process integration and emergency response mechanisms reflects his commitment to innovation in the semiconductor industry.

Collaborations

Throughout his career, Lee has collaborated with esteemed colleagues, including King-Chuan Sun and You-Wei Shen. Their combined efforts push the boundaries of semiconductor manufacturing technologies and streamline operational efficiencies.

Conclusion

Hsing-Hung Lee stands out as a prominent inventor in the semiconductor field. His contributions through patents significantly enhance both manufacturing processes and safety in wafer fabrication. As technology continues to evolve, Lee's innovations pave the way for a more efficient and secure future in semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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