Hsin-Ching Shih

Title: **Innovator Spotlight: Hsin-Ching Shih**

Introduction

Hsin-Ching Shih is a prominent inventor based in Hsin-Chu, Taiwan. Known for his contributions to semiconductor technology, he has developed three notable patents that enhance the manufacturing processes in his field. His inventive spirit has significantly impacted device performance and cleaning methodologies in semiconductor fabrication.

Latest Patents

Hsin-Ching Shih's latest patents showcase his innovative approach to tackling challenges in metal interconnects and substrate cleaning. The first patent, titled "Process for Removing Organic Materials During Formation of a Metal Interconnect," outlines a method involving an ozone water solution combined with various additives to effectively remove organic materials from substrate layers. This technique not only protects the underlying metal layer from oxidation but also ensures that the dielectric properties remain unchanged, ultimately improving device performance.

The second patent, "Tool for Cleaning Substrates," describes a specialized cleaning tool designed to enhance substrate cleaning processes. The tool features a circulation conduit that accelerates the flow of cleaning fluid, efficiently removing particles and polymer films from wafer substrates. The design minimizes the risk of re-deposition, ensuring a thorough cleaning process, supported by a particle filter for optimal cleanliness.

Career Highlights

Hsin-Ching Shih currently works for Taiwan Semiconductor Manufacturing Company (TSMC), a leader in the semiconductor industry. His role emphasizes his expertise in cleaning methodologies and material processing, contributing to improved product yields and device reliability. The patents attributed to him reflect both his technical knowledge and his commitment to advancing semiconductor technologies.

Collaborations

Throughout his career, Hsin-Ching Shih has collaborated with notable professionals in his field, including Yi-Nien Su and Li-Te S Lin. Their teamwork has fostered an environment of innovation and excellence, leading to advancements that are crucial for the high-performance needs of modern electronics.

Conclusion

Hsin-Ching Shih's innovative patents and collaborations continue to shape the landscape of semiconductor manufacturing. His work not only addresses current challenges but also paves the way for future advancements in technology. As he continues to develop cutting-edge solutions, his contributions are invaluable to the industry and the pursuit of efficiency in semiconductor processes.