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For the Inventor, By the Inventor

Tongxiao, Taiwan

Hsien Yu Tseng

This inventor holds 15 USPTO granted patents and 12 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsien Yu Tseng. Retrieved from https://idiyas.com/inventor/hsien-yu-tseng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 9(Granted Patents)


Location History:

  • Tongxiao Township, TW (2020 - 2022)
  • Miaoli County, TW (2023 - 2024)
  • Hsinchu, TW (2023 - 2024)

Company Filing History:

goldMedal15 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2020-2026

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15 patents (USPTO):Explore Patents
1. 12530516 - Method and non-transitory computer-readable medium for arranging components within a semiconductor device (2026-01-20),
2. 12438017 - Electromigration evaluation methodology with consideration of thermal and signal effects (2025-10-07),
3. 12314652 - Methods and non-transitory computer-readable media for inter-metal dielectric reliability check (2025-05-27),
4. 12265773 - Method and apparatus for electromigration evaluation (2025-04-01),
5. 12242790 - Method and apparatus of electromigration check (2025-03-04),
6. 12099792 - Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects (2024-09-24),
7. 12086525 - Electrically aware routing for integrated circuits (2024-09-10),
8. 12027391 - Electromigration evaluation methodology with consideration of thermal and signal effects (2024-07-02),
9. 11687698 - Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects (2023-06-27),
10. 11675950 - Method and apparatus for electromigration evaluation (2023-06-13),
11. 11658049 - Electromigration evaluation methodology with consideration of thermal and signal effects (2023-05-23),
12. 11288437 - Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects (2022-03-29),
13. 11256847 - Method and apparatus of electromigration check (2022-02-22),
14. 11107714 - Electromigration evaluation methodology with consideration of thermal and signal effects (2021-08-31),
15. 10867109 - Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects (2020-12-15),

Title: Inventor Hsien Yu Tseng: Revolutionizing Technology in Tongxiao

Introduction: Hsien Yu Tseng is a pioneering inventor hailing from Tongxiao, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Tseng's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Tseng has established himself as a leading figure in the tech industry, with numerous successful inventions that have significantly impacted the way we harness and utilize energy.

Collaborations: Throughout his career, Tseng has collaborated with top research institutions and universities worldwide to further his research and bring his innovative ideas to life. His partnerships have led to the creation of cutting-edge technologies that are shaping the future of sustainable energy.

Conclusion: Hsien Yu Tseng's relentless pursuit of innovation and his passion for creating a more sustainable world have solidified his reputation as a visionary inventor in Tongxiao and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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