Hsiao-Ling Lu

Title: Hsiao-Ling Lu: Innovator in Copper Interconnect Technology

Introduction

Hsiao-Ling Lu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology, particularly in the area of copper interconnects. His innovative work addresses critical challenges in semiconductor manufacturing.

Latest Patents

Hsiao-Ling Lu holds a patent for a "Ti liner for copper interconnect with low-k dielectric." This invention tackles the issue of carbon contamination in copper backend integrated circuits that utilize low-k organic-based interlayer dielectrics. The composite liner layer he developed employs titanium (Ti) as the bottom layer, which effectively getters carbon and other contaminants. To prevent the known problem of Ti reacting with copper to form a high resistivity compound, he introduced a layer of titanium nitride (TiN) that isolates the Ti from the copper.

Career Highlights

Hsiao-Ling Lu is associated with International Business Machines Corporation (IBM), where he has been instrumental in advancing semiconductor technologies. His work has been pivotal in enhancing the reliability and performance of integrated circuits.

Collaborations

He has collaborated with notable colleagues, including Chih-Chao Yang and Larry Clevenger, contributing to various projects that push the boundaries of technology in the semiconductor industry.

Conclusion

Hsiao-Ling Lu's innovative contributions to copper interconnect technology exemplify the importance of addressing challenges in semiconductor manufacturing. His work continues to influence the field and pave the way for future advancements.