International Business Machines Corporation

Hsiao-Ling Lu

Chih-Chao Yang

Andrew Herbert Simon

Yun-Yu Wang

Kwong Hon Wong

Larry Clevenger

Jeffrey R Marino

Stanley J Klepeis

In copper backend integrated circuit technology, advanced technology using low-k organic-based interlayer dielectrics have a problem of carbon contamination that dos not occur in circuits using oxide as dielectric. A composite liner layer for the copper lines uses Ti as the bottom layer, which has the property of gettering carbon and other contaminants. The known problem with Ti of reacting with copper to form a high resistivity compound is avoided by adding a layer of TiN, which isolates the Ti and the copper.

Ti liner for copper interconnect with low-k dielectric

Growing community of inventors

Hsin-Chu, Taiwan

Hsiao-Ling Lu