Hsiang-Pin Hou

Title: Hsiang-Pin Hou: Innovator in Semiconductor Technology

Introduction

Hsiang-Pin Hou is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative methods in photoresist stripping.

Latest Patents

Hsiang-Pin Hou holds a patent for a method of photoresist strip. This method involves providing a semiconductor substrate and performing an immerse step and a strip step. The semiconductor substrate comprises a base, a bonding pad, a protective layer, an under bump metallurgy layer, a patterned photoresist layer, and a bump. The patterned photoresist layer covers the under bump metallurgy layer and a lateral surface of the bump. A first connection interface is formed between the patterned photoresist layer and the lateral surface of the bump, while a second connection interface is formed between the patterned photoresist layer and the under bump metallurgy layer. In the immerse step, the patterned photoresist layer contacts a chemical solution that degrades the bond strength of the first connection interface. Consequently, in the strip step, the semiconductor substrate is scoured by a flow with an appropriate force of impact, which strips the patterned photoresist layer from the base. Hsiang-Pin Hou has 1 patent to his name.

Career Highlights

Hsiang-Pin Hou is currently employed at Chipbond Technology Corporation, where he continues to advance semiconductor technologies. His work has been instrumental in improving processes related to semiconductor manufacturing.

Collaborations

Hsiang-Pin Hou has collaborated with notable colleagues such as Cheng-Hung Shih and Kuo-Hua Yang. Their combined expertise has contributed to the success of various projects within the semiconductor industry.

Conclusion

Hsiang-Pin Hou is a distinguished inventor whose work in semiconductor technology has led to innovative solutions in photoresist stripping. His contributions continue to impact the industry positively.