Hsiang Chi Chien

Title: Hsiang Chi Chien: Innovator in Semiconductor Manufacturing

Hsiang Chi Chien is a notable inventor based in Pingtung, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, showcasing his expertise through his innovative patent.

Latest Patents

Hsiang Chi Chien holds a patent for a manufacturing method of a semiconductor structure. This method involves several steps, including the provision of a first wafer that consists of a first substrate and a first device layer. A second wafer is also provided, which includes a second substrate and a second device layer. The second device layer is bonded to the first device layer. An edge trimming process is performed on both wafers to expose the upper surfaces of the substrates and to create a damaged region in the first substrate. A first photoresist layer is then formed on the second wafer, which allows for the removal of the damaged region using the photoresist as a mask. This innovative approach enhances the efficiency and effectiveness of semiconductor manufacturing.

Career Highlights

Hsiang Chi Chien is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work there has allowed him to apply his innovative ideas and contribute to advancements in semiconductor technology.

Collaborations

Hsiang Chi Chien has collaborated with notable coworkers, including Kun-Ju Li and Hsin-Jung Liu. These collaborations have further enriched his work and contributed to the development of cutting-edge semiconductor technologies.

Conclusion

Hsiang Chi Chien is a prominent figure in the semiconductor manufacturing field, with a patent that reflects his innovative spirit and technical expertise. His contributions continue to influence the industry and pave the way for future advancements.