Howard Bartlow

Title: Howard Bartlow: Innovator in Microelectronic Packaging

Introduction

Howard Bartlow is a notable inventor based in Longmont, Colorado. He has made significant contributions to the field of microelectronics, holding a total of 2 patents. His work focuses on innovative packaging solutions that enhance the performance and reliability of microelectronic devices.

Latest Patents

Howard Bartlow's latest patents include "Package including wires contacting lead frame edge" and "Package including proximately-positioned lead frame." The first patent describes a microelectronic package that features a lead frame with a major surface and a die with a bond pad. This design allows for a wire to electrically connect the lead frame to the die without bending, ensuring optimal performance. The second patent outlines a microelectronic package that includes a die with a flange and a lead frame positioned closely to the die, enhancing the overall efficiency of the package.

Career Highlights

Howard Bartlow is currently associated with Triquint Semiconductor Corporation, where he applies his expertise in microelectronic packaging. His innovative designs have contributed to advancements in the industry, making him a valuable asset to his company.

Collaborations

Throughout his career, Howard has collaborated with talented individuals such as William McCalpin and Binh Le. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

In summary, Howard Bartlow is a distinguished inventor whose work in microelectronic packaging has led to significant advancements in the field. His patents reflect his commitment to innovation and excellence in technology.