Triquint Semiconductor Corporation

Howard Bartlow

William McCalpin

Binh Le

Michael Lincoln

Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a lead frame including a major surface, and a die having including a bond pad. A wire may electrically couple a location of the major surface of the lead frame with the bond pad of the die, the wire being situated such that the wire is substantially unbent from the location of the major surface to an edge of the lead frame.

Package including wires contacting lead frame edge

Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a die having a first side and a second side, opposite the first side, a flange coupled to the first side of the die, and a lead frame proximately positioned relative to the die and coupled to the second side of the die. Other embodiments may be described and claimed.

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Longmont, CO, United States of America

Howard Bartlow