The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
Nov. 14, 2008
Applicants:
Howard Bartlow, Longmont, CO (US);
William Mccalpin, Boulder, CO (US);
Michael Lincoln, Longmont, CO (US);
Inventors:
Howard Bartlow, Longmont, CO (US);
William McCalpin, Boulder, CO (US);
Michael Lincoln, Longmont, CO (US);
Assignee:
TriQuint Semiconductor, Inc., Hillsboro, OR (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a die having a first side and a second side, opposite the first side, a flange coupled to the first side of the die, and a lead frame proximately positioned relative to the die and coupled to the second side of the die. Other embodiments may be described and claimed.