Company Filing History:
2 out of 233 
1 out of 33 Years Active: 2007-2013
Title: The Innovations of William McCalpin
Introduction
William McCalpin is a notable inventor based in Boulder, Colorado. He has made significant contributions to the field of microelectronics, holding a total of 3 patents. His work focuses on innovative packaging solutions that enhance the functionality and efficiency of microelectronic devices.
Latest Patents
Among his latest patents is a "Package including wires contacting lead frame edge." This invention describes a microelectronic package that features a lead frame with a major surface and a die that includes a bond pad. The design allows for a wire to electrically connect a location on the lead frame to the bond pad, ensuring that the wire remains substantially unbent from the lead frame's edge. Another significant patent is the "Package including proximately-positioned lead frame." This invention outlines a microelectronic package that includes a die with a first and second side, a flange attached to the first side, and a lead frame positioned closely to the die and connected to its second side.
Career Highlights
William McCalpin has worked with several prominent companies in the microelectronics industry, including Triquint Semiconductor Corporation and Integration Associates Incorporated. His experience in these organizations has contributed to his expertise and innovative approach to microelectronic packaging.
Collaborations
Throughout his career, McCalpin has collaborated with notable professionals such as Howard Bartlow and Jean-Luc Nauleau. These collaborations have likely enriched his work and led to further advancements in his field.
Conclusion
William McCalpin's contributions to microelectronics through his patents and collaborations highlight his role as an influential inventor. His innovative designs continue to impact the industry positively.